ABS Plating Parts

• High efficiency
• Low maintenance
• Long service life
• Resistant to temperature variations

Application:

• Automobile Industry

• Improves wet-ability in the etching process.
• Accelerates etching effect for the special PC/ABS resin.
• Roughens the resin surface. Forms polarity radicals that let Pd-Sn colloids adsorb.
• Accelerates seepage of chromic acid remaining in rack contacts.
• Accelerates the adsorption of Pd-Sn colloids on the special PC/ABS resin.
• Prevents water from directly dragged into the catalyzing bath and suppresses hydrolysis of colloids.
• Adsorbs palladium that later becomes the nuclei of catalyses as Pd-Sn colloids.
• Dissolves excessive Sn in the colloids adsorbed and activates the palladium.
• Forms a thin nickel film on the resin surface and gives conductivity.
• Activates the electrolysis plated nickel film.
• Prevents burning at the rack contacts and improves adhesion.
• Prevents displacement of an excessive quantity of copper in the acid copper plating process.

Application:

• Automobile Industry